Will a NGL emerge before EUV?

Interviewed :Bill Arnold, Gene Fuller, Phil WareRelevant Date :2013-10-22

Summary : Will there be a new wafer exposure technology before EUV makes it to production? Some Next Generation Lithography? In this historic video from 2003, Lithography experts, Bill Arnold, Gene Fuller, and Phil Ware discuss the issue. At the time, 193nm scanner

Bill Arnold, Gene Fuller, ...

22 Oct 2003

How is revenue recogniz ...

Chip execs, Bill Arnold, Gene Fuller, and Phil Ware weigh in on the then new FASB accounting standards for revenue recognition that affect semiconductor equipment companies. At the time it created lots of issue ... See more

Sunlin Chou

05 Oct 2004

How Power, Performance, ...

Sunlin Chou discusses how managing these parameters have evolved over time, in this 2004 conversation. As semiconductor chips get larger it would seem that they would consume more power. Learn why this is not t ... See more

Mark Bohr

09 Mar 2009

The State of Process De ...

Mark Bohr: Senior Fellow and Director of Process Architecture & Integration, Intel: The State of Process Development at Intel - 32nm, 22nm, 15nm, Defect Densities, Hi-K, Strained Silicon & Billions of Transisto ... See more

Mark Bohr

24 Oct 2005

Intel moves 65nm to man ...

Mark Bohr, Intel Senior Fellow, Technology and Manufacturing Group discusses moving Intel's 65nm process technology to manufacturing in this 2005 interview. ... See more