Test Panel: F. Bode, Bode Enterprises on... Open Architecture

Interviewed :F. BodeRelevant Date :2005-03-29

Summary : Test Panel: F. Bode, Bode Enterprises on... Open Architecture

How EDA evolved from crude mainframes that could hardly draw a line, to today's hierarchical software that keeps track of the billions of things that have to happen to turn an idea into a design ... See more

Jim Morgan

23 Mar 2006

Keys to Success

In the final installment of this three-part interview, Jim Morgan expands on the strategies that made AMAT the successful company it is today. Topics covered include why perseverance works; balancing Kaizen m ... See more

Mark Bohr

09 Mar 2009

The State of Process De ...

Mark Bohr: Senior Fellow and Director of Process Architecture & Integration, Intel: The State of Process Development at Intel - 32nm, 22nm, 15nm, Defect Densities, Hi-K, Strained Silicon & Billions of Transisto ... See more

Sunlin Chou

05 Oct 2004

Intel's R&D Pipeline

The history of semiconductor research at Intel is discussed in this 2004 conversation with Sunlin Chou. ... See more

Mark Jagiela

12 Aug 2003

Consolidation in the AT ...

Mark Jagiela, President of Teradyne's Semiconductor ATE Group, on consolidation in the semiconductor test equipment industry, answering the question of why IC tester companies don't die. Semiconductor History b ... See more

Hans Stork on Low-k Interc ...

18 Jul 2003

Low-k Interconnect Mate ...

In this historic 2003 video, Hans Stork discusses the status of Low-k Interconnect Materials for semiconductor metal layers. ... See more

Mike Goldstein & Daisuke O ...

23 Jan 2008

First 450mm Wafer from ...

Nippon Mining & Metals: Daisuke Oka, Strategic Account Manager & Intel: Mike Goldstein, Principal-Materials Engineer: First 450mm Wafer from Nippon Mining & Metals ... See more