Lithography Panel 2007: Gene Fuller, Nikon

Interviewed :Gene FullerRelevant Date :2007-11-05

Summary : Lithography Panel 2007: Gene Fuller, Nikon

Annexure :

In this video, Gene Fuller covers the latest progress in lithography at Nikon in both immersion and EUV. In addition to the above topics, he also discusses the progress that's been made with immersion at Nikon, with results that show defects should no longer be an issue with immersion if you've got the right tool. He also discusses how immersion is different than dry in manufacturing and how you will need to approach it differently to optimize the results in your fab . . .

Andy Grove

15 Jun 2004

Andy Grove on the devel ...

Andy Grove talks at IMEC 2004 - the Intel Manufacturing Excellence Conference - about the history of manufacturing and how early practices entered into the Intel legacy flow. Topics include issues deploying new ... See more

Sunlin Chou: A tribute

05 Dec 2018

Sunlin Chou: A tribute

Sunlin Chou, who passed December 5th, 2018, and his contributions to the semiconductor industry. Sunlin’s role was to develop a new business model for research and development. ... See more

Charlie Sporck

10 Oct 2007

Fairchild & Chip Making

Charlie Sporck arrived at Fairchild Semiconductor in 1959. Between then and through the 1980's he built a strong reputation and ultimately became respected by many as America's greatest manufacturing executive ... See more

Dan Maydan

30 Nov 2007

On the 20th Anniversary ...

Applied Material's Precision 5000 changed the direction of tool architecture, lowering development cost and making it possible to bring new process technology to market faster than ever before. ... See more

Kenneth L. Schroeder

11 Jul 2005

How KLA-Tencor Meets St ...

Ken Schroeder, then President & CEO of KLA-Tencor, discusses the history of process control and the role K-T played in improving wafer fab yields for semiconductor companies in this 2005 video. ... See more

Mark Jagiela

12 Aug 2003

Open ATE Architectures ...

Mark Jagiela, President of Teradyne's Semiconductor ATE Group, on the question of the benefits of Multiple Test Platforms over Open Architectures for semiconductor companies testing of ICs. The semiconductor in ... See more

Steve Nakayama

29 Nov 2004

2003: Steve Nakayama

Steve Nakayama honored for his contribution in helping globalize the semiconductor equipment industry. He talks about how ITPC got started and the methods he used to convince Japanese semiconductor executives t ... See more