Gary Patton, Vice President of the Semiconductor Research and Development Center of IBM's Systems and Technology Group, on the business tactics behind their implementation of Hi-K strained silicon, Air Gap, & eDRAM as well as their strategy of reducing design costs for 32nm. Find out why some companies are skipping nodes and how they are able to do it.
In the final installment of this three-part interview, Jim Morgan expands on the ...
Art Zafiropoulo was honored for championing technology through innovative market ...
In this segment, Wilf Corrigan details the structural ingredients of the ASIC se ...
Thomas Sonderman discusses Automated Precision Manufacturing and how it allows A ...
Ed Segal was honored for his establishment of a global representative organizati ...
Paul Otellini was the first to pass from the semiconductor industry’s second g ...
Hans Stork addresses the role E-beam maskless lithography for low-volume semicon ...
Lithography Panel 2007: Audience Q&A
Lithography Panel 2007: Gene Fuller, Nikon
Lisa Su discusses IBM’s Roadmap in this 2006 interview
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