Summary : This section examines the vendors who supply semiconductor manufacturing equipment. There are approximately 534 of them. The top five are shown below in Figure 2.0.0-1. In 1989, these five companies held a 26.4% share of the semiconductor equipment market. The market share for the top five equipment suppliers was virtually unchanged over the 1988 figure, 26.3%. Japan-based firms hold four of the top five position in 1989, as compared to only three in 1988. These are: Tokyo Electron Ltd., Nik ... See More
Key events drawn from archived documents in VLSI's library. These documents have ...
Key events drawn from archived documents in VLSI's library. These documents have been carefully selected for their historical significance. ... See more
Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconducto ...
Tencor (later evolved to be KLA - Tencor) is in the bedrock of the semiconductor equipment industry. It developed many products that were essential to chip manufacturing. Some are still made today. ... See more
VLSI's Customer Satisfaction Survey Celebrates 30 Years of award winning semicon ...
VLSI's Customer Satisfaction Survey Celebrates 30 Years of award winning semiconductor equipment companies.
A Look Back... 2018 marked the 30th year VLSIresearch has released its annual Customer Satisfaction ... See more
The replacement of optical lithography with e-beam direct write for semiconducto ...
The replacement of optical lithography with e-beam direct write for semiconductor manufacturing has been predicted since Gordon Moore penned his 1965 paper, writing "It is worth noting that this density of comp ... See more
Dicing equipment is used to cut apart individual die on a wafer. Typically, a di ...
Dicing equipment is used to cut apart individual die on a wafer. Typically, a dicing saw will cut along the wafer in an unused section between dice that is called the 'street'. · Such streets are typically thre ... See more
Key images drawn from donated and archived documents in VLSI's library. These im ...
Key images drawn from donated and archived documents in VLSI's library. These images have been carefully selected for their historical significance as they show history in the making. ... See more
Assembly equipment consists of those types of equipment used to separate the co ...
Assembly equipment consists of those types of equipment used to separate the completed wafer into its individual dice and to assemble each die into its own package. The assembly equipment market comprises roug ... See more
Dry processing methods are chemical processes that use a plasma to drive the re ...
Dry processing methods are chemical processes that use a plasma to drive the reaction. Dry etching is the major segment of dry processing. Today, virtually all etching processes are dry processes. Typically, ... See more
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